India's electronics sector is worth more than $150 billion today, and our target is now even bigger. By the end of this decade, we want to take our electronics sector to $500 billion in production. It will create around 6 million jobs for the country's youth. 

Electronics Component Manufacturing

Scheme

About Ministry

The Ministry of Electronics and Information Technology (MeitY), under Government of India, is a stand-alone ministerial agency, responsible for formulating and implementing national policies and programs aimed at enabling the continuous development of the electronics and IT industry. MeitY’s focus areas include the development, promotion, and regulation of the electronics and IT industry in India, fostering digital governance, enabling innovation in emerging technologies and promoting cybersecurity initiatives within country.

Shri Ashwini Vaishnaw

Shri Ashwini Vaishnaw

HON’BLE MINISTER
Shri Jitin Prasada

Shri Jitin Prasada

HON’BLE MINISTER OF STATE

About Scheme


Objective

To develop robust component manufacturing ecosystem by attracting investments (global / domestic) across the value chain by integrating its domestic electronic industry with the Global Value Chains (GVCs).

Target Segments

The Target Segment Category under Scheme includes
(A) Sub-assemblies
(B) Bare components
(C) Selected bare components
(D) Supply chain ecosystem and Capital equipment.

Types of Incentive

The scheme provides differentiated fiscal incentive on target segment products in terms of turnover
(a)turnover linked incentive
(b)capex incentive and
(c) hybrid incentive[ i.e. combination of both (a) and (b) ]


Tenure of the Scheme

Turnover Linked Incentive:
Six (6) years with one (1) year of gestation period
Capex Incentive: Five (5) years


Target Segments


The Target Segment under Scheme for Electronics Component Manufacturing shall include :

A

Sub-assemblies

1.
Display module sub-assembly
2.
Camera module sub-assembly
B

Bare components

3.
Non-SMD passive components
4.
Electro-mechanicals
5.
Multi-layer PCB
6.
Li-ion Cells for digital application (excluding storage and mobility)
7.
Enclosures for Mobile, IT Hardware products and related devices
C

Selected bare components

8.
HDI / MSAP / Flexible PCB
9.
SMD passive components
D

Supply chain ecosystem and Capital equipment

10.
Supply chain of sub-assemblies (A) & bare components (B) & (C)
11.
Capital goods used in electronics manufacturing including their sub-assemblies and components